SK hynix Breaks Ground on $4 Billion Indiana AI Memory Facility

The project, representing an investment of over $4 billion, is slated to open its cleanroom facilities by October 2028, with mass production of critical AI memory components expected to follow in the second half of 2029. The Indiana site will operate in tandem with the company’s South Korean headquarters: wafers manufactured in Korea will be shipped to Indiana for specialized final packaging and testing, ensuring the finished chips meet the requirements of U.S. customers. Upon reaching full commercial capacity, the facility is projected to employ approximately 1,000 workers.

Beyond production, the site will feature an R&D testbed designed to foster collaboration with Purdue University and various industry partners, aiming to accelerate the development of advanced packaging technologies. SK hynix expects the initiative to create nearly 7,000 direct and indirect jobs throughout the construction and operational phases. CEO Kwak Noh-Jung described the move as a gateway for delivering domestic-made HBM, emphasizing the company's intent to integrate deeply into the U.S. AI innovation ecosystem while leveraging local talent, including a recruitment program dedicated to U.S. Forces Korea veterans.