Pegatron Debuts Liquid-Cooled AI Infrastructure at OCP Global Summit

The centerpiece of the showcase is the RA4803-72N3 rack-scale platform, which integrates 36 NVIDIA Vera CPUs alongside the Rubin GPU array. By leveraging OCP-aligned standards such as the ORv3 busbar and DC-MHS, Pegatron aims to simplify the deployment of massive AI clusters. The company is also highlighting the AS210-2T1-8H3, a 2U liquid-cooled system that supports diverse processor configurations, including Intel Xeon 6 and AMD EPYC 9006 chips.

Beyond raw computing power, the firm is emphasizing its end-to-end production pipeline. Utilizing NVIDIA DSX workflows, Pegatron connects digital-twin simulations directly to physical manufacturing and thermal validation. According to Pegatron President and Co-CEO Gary Cheng, this integration allows for rigorous rack-level testing before hardware reaches the data center floor. The portfolio also includes high-density storage solutions, such as the SS201-1A1, designed to handle the throughput demands of modern AI data pipelines using PCIe Gen 6 connectivity.