Nova Secures Tool-of-Record Status for Advanced Chip Packaging

The Nova WMC™ platform is designed to manage high warpage, non-symmetric shapes, and varied surface conditions within a single, modular system. By providing high-throughput scanning and nanometer-level fidelity, the platform addresses critical bottlenecks that arise when scaling production for memory and foundry applications.

"Following a successful introduction, Nova WMC™ is now entering a rapid growth phase," said Gaby Waisman, President and CEO of Nova Ltd. The company reports that demand is accelerating across its portfolio, with the platform becoming a key component for customers handling advanced packaging and HBM applications. As the foundry customer expands its capacity, Nova anticipates further deployment opportunities for its hardware and software suite.