Annual growth is projected at a compound rate of 7.43%, driven largely by the massive 12.0 GW of new data center capacity added each year. While direct liquid cooling is increasingly deployed to manage intense heat at the chip level, air-based systems remain essential for maintaining room conditions and handling residual thermal loads. This shift is fueling a surge in demand for large-scale fan walls and thermal walls, which are expected to capture $2.73 billion in market value by 2035.
Operators are also prioritizing long-term reliability, leading to a projected $2.35 billion aftermarket for service and maintenance. North America currently dominates the landscape, holding a 40.5% share of total market value, followed by the Asia Pacific and European regions. Major industry players like Vertiv and Schneider Electric are already adjusting their portfolios to capture this shift toward hybrid cooling, evidenced by recent product launches and strategic acquisitions focused on rear-door heat exchangers and advanced liquid-cooling components.



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