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UfiSpace Debuts 1.6T Liquid-Cooled AI Networking at OCP Global Summit

UfiSpace Debuts 1.6T Liquid-Cooled AI Networking at OCP Global Summit

At the OCP Global Summit 2026 in San Jose, UfiSpace is showcasing a live demonstration of its 1.6T liquid-cooled AI networking platform. By validating the thermal feasibility of high-density fabrics, the company aims to address the power and cooling constraints currently challenging hyperscale data center infrastructure.

The centerpiece of the exhibit is the S9331-64HO3L, a 102.4Tbps liquid-cooled system utilizing the Broadcom Tomahawk 6 ASIC. Featuring 64 ports of 1.6T capacity, the platform operates with a Cooling Distribution Unit to prove system-level readiness for future AI clusters. For facilities maintaining air-cooled environments, UfiSpace is also presenting the S9331-64HO, a 3RU platform designed to provide a high-performance bridge for operators transitioning toward liquid cooling.

Beyond thermal management, UfiSpace is expanding its portfolio with deep-buffered routers designed to eliminate packet drops across distributed AI fabrics. The S9630-32HO, powered by Qumran 4D silicon, offers 51.2Tbps capacity with 32GB of packet buffering. In a joint initiative with GeNopsys Technologies, the company is also demonstrating an integrated Ethernet-optical switching solution. By pairing the S9321-64E switch with GeNopsys’ optical circuit switching, the partners intend to remove O-E-O conversion bottlenecks, thereby accelerating training times and reducing energy consumption in large-scale AI data centers.

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