The company’s new platform targets the evolving requirements of Co-Packaged Optics, specifically supporting 2D Fiber Array Units capable of handling bandwidths up to 12.8 Tbps. By integrating five-axis laser control with advanced positioning, the system achieves a drilling accuracy of ±0.5 μm. This focus on precision is designed to accommodate the complex hole geometries required for next-generation optical interconnects.
Beyond optical components, E&R is positioning its broader portfolio to address thermal and density challenges in 2.5D and 3D IC architectures. The company’s integrated suite includes laser drilling for blind vias, multi-beam marking, and controlled thermal cutting. By combining these laser processes with high-stability plasma systems for surface activation, the firm provides an end-to-end workflow for high-density substrates. To support this hardware, E&R has expanded its service infrastructure across major U.S. semiconductor hubs, including Portland, Arizona, and Texas, to provide localized technical support and rapid diagnostics. The company will showcase these capabilities at the Moscone Center from October 13–15, 2026, at booth #2153.
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