SUSS MicroTec Enters Wafer-Cleaning Market With GreenTec Launch

The GT200 system serves as the foundation for SUSS’s new strategy, integrating proprietary technologies originally developed for photomask processing. By combining the TurbulenStrip and CrustBuster technologies, the company offers a hybrid cleaning approach. TurbulenStrip utilizes batch soaking and single-wafer handling for residue removal, while the CrustBuster uses in-situ UV technology to break down organic materials directly on the wafer surface. This configuration is specifically tailored for MEMS, RF, power device, and CMOS applications.

Chief Executive Officer Burkhardt Frick described the move as a major milestone for the firm’s Ambition 2030 strategy. Beyond the hardware, SUSS is offering joint evaluation programs and process co-development to help manufacturers transition from R&D to high-volume production. The company’s roadmap includes the release of a 300 mm high-volume manufacturing platform in 2027, followed by a 200 mm high-volume version in 2028. According to Yuta Nagai, Senior Vice President of Photomask Solutions, the company decided to accelerate the 300 mm development timeline due to significant customer interest in eco-friendly, high-performance cleaning solutions.