E&R Engineering Targets CPO and Glass Substrates at SEMICON Taiwan

The company’s new FAU laser processing solution addresses the requirements of 2D configurations supporting bandwidths up to 12.8 Tbps. By utilizing five-axis control and precision micromachining, the system achieves a drilling accuracy of ±0.5 μm, accommodating diverse hole geometries and angles essential for high-density optical components.

Beyond optical arrays, E&R is leaning into the industry shift toward glass substrates for AI and high-performance computing. Their specialized equipment handles Through-Glass Via processing, glass core drilling, and carrier debonding. To ensure surface integrity, the company provides cleaning and descum processes to remove polymer residue after temporary carrier separation.

Hardware highlights at the upcoming Taipei Nangang Exhibition Center event include the PHB-600A, optimized for large-format glass panels, and the R-300R Hybrid Plasma System. The latter features independently controlled microwave and radio-frequency power sources, allowing for flexible surface activation and deep silicon etching. These tools are designed to bridge the gap between R&D validation and full-scale production, with the company showcasing its full suite at booth M1048 from September 2 to 4.