The EP-200N features a hexa-core Arm Cortex-A55 architecture, complemented by an 8 eTOPS neural processing unit designed for high-performance AI tasks at the edge. To accommodate the harsh conditions typical of industrial automation and healthcare, the module is built to operate within a temperature range of -40°C to +85°C. It comes equipped with 8 GB of LPDDR5 memory and 32 GB of eMMC storage, providing a scalable foundation for robotics, machine vision, and medical imaging applications.
Silex Technology aims to reduce engineering bottlenecks by providing a Yocto Linux BSP that includes integrated Wi-Fi 6E drivers. By combining this module with NXP-based connectivity solutions, developers can achieve a unified system from application processing to wireless communication. According to Keith Sugawara, CEO of Silex Technology America, the design focuses on simplifying the transition from prototype to mass production for OEMs. Evaluation kits for the platform are scheduled for release in September 2026, with a live demonstration planned for Embedded World North America in Anaheim.
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